NEDO Adds Four New Themes to "Semiconductor Application Chip Project"
(July 15, 2005)
On June 30, 2005, NEDO announced that it has added the four new themes listed below to its "Semiconductor Application Chip Project" after a public solicitation was held from March 25th to May 16th. This project aims to develop semiconductor chip technologies that can advance the technology level of information appliances (including those used on vehicles), for example, in terms of improved performance, reliability and energy consumption. Software technologies necessary for practical operation of new semiconductor chips will also be developed.
- "Research and Development of FeRAM/FD-SOI Integrated Application Chips"
Entrusted to Oki Electric Industry Co., Ltd.
- "Research and Development of a Reconfigurable Architecture for Information Appliances "
Entrusted to Sanyo Electric Co., Ltd.
- "Research and Development of Real-Time Multi-Core Technology for Information Appliances"
Entrusted to Waseda University, Hitachi Ltd. and Renesas Technology Corp.
- "Research and Development of TRON-SMP Multimedia Secure Chip for Information Appliances"
Entrusted to University of Tokyo, Personal Media Corporation and Renesas Technology Corp.
For details regarding the project, please visit NEDO's Japanese-language Web site at:
http://www.nedo.go.jp/informations/koubo/170630_6/170630_6.html
http://www.nedo.go.jp/informations/koubo/170630_6/betten2.pdf
NEDO Contact Persons:
Mr. Kinugawa, Mr. Kato
Electronic and Information Technology Development Department
Tel: +81-44-520-5210
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