成果報告書詳細
管理番号20110000001209
タイトル*平成22年度中間年報 ナノテク・先端部材実用化研究開発/ナノ粒子と極低酸素技術による超微細銅配線樹脂基板のインクジェット形成技術の研究
公開日2011/9/9
報告書年度2010 - 2010
委託先名株式会社イオックス 株式会社SIJテクノロジ 日本特殊陶業株式会社 大阪市立工業研究所
プロジェクト番号P05023
部署名電子・材料・ナノテクノロジー部
和文要約和文要約等以下本編抜粋:(1)事業目的
近年、電子デバイスの大幅なコストダウンのために、スパッタレス、マスクレスを実現する新しい微細配線形成技術や、銀から銅へのマテリアル・イノベーションを早急に進め、銅配線製造技術としての確立を計ることの必要性が報告されている。本研究開発では、ナノ粒子製造技術、極低酸素技術、超微細インクジェット技術の要素技術を統合し、半導体製造プロセスの中でも小型化と微細化が要求されるICパッケージ基板を対象とした銅の微細配線技術を確立することを目的とする。本研究開発の成果であるシングルミクロンの銅配線は、2018年頃に世界標準の配線ルールとして用いられることが予測されており、先端的な情報家電の分野に対して大きく寄与することが期待できる。
英文要約1 "Development of Super Inkjet equipment and its process for ultrafine copper pattern" The first step in the evaluation for printable copper wiring could be performed by using proto-type of copper ink, super inkjet printer and oxygen pump system.Screening evaluation for 17 kinds of copper inks have been carried out from different points of view, such as, pot life, patterning stability, drying speed, wetting ability, jetting ability, etc. The line formation of about 40μm in width, about 1.3μm in height could be achieved with the proto-type ink. We will continue trying to improve the materials and process so that it will be able to clear the target value on interconnection resistance, adhesion strength, L&S, thickness control, based on the proto type ink in the coming fiscal year. 2 "Research and development of the synthetic process of Cu nano-particles and the application to ink material" In this part, we have developed the large scale synthetic process of copper nanoparticles by reduction of copper salts in polar solvent in the presence of dispersing agent. In the view from reliability of the copper nanoparticles and copper inks as conductive materials for electronic circuit formation, the products should not contain chlorine, sulfur, any halogen atoms and alkali metals. For this reason, we have developed the synthetic process of copper nanoparticles without using these atoms in all materials. The copper nanoparticle inks are also prepared by the addition of solvents and dispersing agent with the control of the particle size, dispersibility, concentration, viscosity and vapor pressure. 3 "Development of extremely-low oxygen partial pressure technology" We introduced a new oxygen analyzer MX1-A from Japan Air Gases Company to know the oxygen concentration in sample gases at room temperature. We developed a data-acquisition system including this analyzer and have started performance checking with a zero-oxygen gas. So far readings have fluctuated between 0.003 and 2ppb, which is to be addressed soon. We have also started optimizing the reduction sintering of inkjet-printed copper patterns. In one ink (#002) a resistivity as low as 50 microhm cm has been achieved for the sample heated at 250 degrees Celsius for 72h. Still it contains a lot of crevasses, which have to be eliminated through the improvement of inks. 4 "Evaluation of Ink-jet Process Technology for Ultra-fine patterning substrate" We have newly selected two types of new materials, epoxy material and new resin material. Characteristic property of each material is low CTE and low dielectric loss tangent respectively. Surface treatment of these resins is required to improve adhesion strength of pattern and to keep its reliability because of ultra-fine pattern. We have processed three different surface treatments; chemical roughening, O2 plasma treatment, and CF4 plasma treatment. In order to form ultrafine pattern on these surface-treated insulating resins, we have established a method to evaluate ink wettability by measuring contact angle. Contact angle of Cu nano-ink decreases and the wettability increases due to the surface treatments.
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