成果報告書詳細
管理番号20110000001400
タイトル*平成22年度中間年報 希少金属代替材料開発プロジェクト 精密研磨向けセリウム使用量低減技術開発及び代替材料開発/4BODY研磨技術の概念を活用したセリウム使用量低減技術の開発
公開日2011/12/13
報告書年度2010 - 2010
委託先名学校法人立命館大学 株式会社アドマテックス 九重電気株式会社 株式会社クリスタル光学
プロジェクト番号P08023
部署名電子・材料・ナノテクノロジー部
和文要約和文要約等以下本編抜粋:1. 研究開発の内容及び成果等
本研究開発の目的は,ガラスの鏡面研磨材として使用される酸化セリウムの使用量を30%以上削減することである.そこで,3つの戦略でこれを実現することにした.一つは酸化セリウムの成分割合を削減した複合砥粒の開発である.二つ目は,通常研磨に比較して40%以上の高加工能率と同等の仕上げ面粗さを持つ加工技術の開発であり,最後は同等の加工特性を持った砥粒を全く使用しない加工技術の開発である.通常の遊離砥粒研磨は,工作物,砥粒,工具の3つの要素からなる3BODY研磨技術で,研磨能率と仕上げ面粗さを同時に高めることは難しい.これに対して プロジェクトリーダが開発した4BODY研磨においては,このトレードオフの関係が打ち破られ,仕上げ面粗さを維持しながら研磨能率を向上することが可能であること.この4BODY研磨法の概念から,本研究開発では砥粒,メディア粒子,研磨パッド(工具),プロセス技術の4つの観点に注目し,それぞれの因子に関して2つの研究項目を選定し,すなわち合計8つの研究項目において研究開発を実施した.その具体的内容は以下の通りである.
英文要約The purpose of this research project is to reduce more than 30% of cerium oxide usage as mirror-polishing agent for glass material. Then three research strategies were established to realize the purpose. First is to develop abrasive-free processing which has same machining performance with conventional polishing. Second is to develop composite abrasives to decrease concentration of cerium oxide which have the same finishing performance and third is to develop process technologies which have more than 40% higher removal rate and same surface finish in comparison with conventional polishing. The conventional loose abrasive polishing technology which consists of three bodies ;workpiece, abrasive and polishing pad, had difficulty in increase of removal rate and surface finish concurrently, as they have the trade-off relationship. On the other hand, "Four-body finishing" which applies the fourth component; media particle, can break the relationship and a high form accuracy. Then this research project has been carried out in four viewpoints of abrasives, media particles, polishing pads (as a tool) and process technology by applying the concept of 4-body finishing method.
In this year, we investigated the effect of the shape and specific gravity of polymer particles of composite abrasives on a performance of glass polishing. The dimpled polyurethane particles and SiO2 (500 nm in diameter, 30 wt%) included polyurethane particles were used as mother particles. The removal rate of glass polished using composite abrasives with dimpled particles and SiO2included particles are about 50 and 33 percent higher than that using conventional polishing, respectively. The composite abrasive polishing exhibits a smaller edge-roll off than conventional polishing. Furthermore, the improvement of surface waviness, especially in a range of spatial wavelength of 10-3 - 10-4 m, was confirmed
Epoxy resin polishing pads were also developed. It was found that the removal rate of glass surface using epoxy polishing pad was approximately two times higher than those using urethane polishing pad, which corresponding to a 50 percent decrease in a usage of CeO2 abrasives. The waviness and edge roll-off of polished glass surface were markedly improved by utilizing an epoxy polishing pad, while the surface roughness of glass surfaces finished by epoxy pad was comparable to those finished by an urethane pad. Moreover, several abrasive materialswere used as polishing abrasives. Commercially available ZrO2 abrasives combined with the epoxy polishing pad exhibited about 70 percent higher removal rate than the CeO2 with the conventional urethane polishing pad. The results indicate that the CeO2 abrasives are completely substituted for ZrO2 abrasives.
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