成果報告書詳細
管理番号20120000000798
タイトル*平成23年度中間年報 希少金属代替材料開発プロジェクト/精密研磨向けセリウム使用量低減技術開発及び代替材料開発/4BODY研磨技術の概念を活用したセリウム使用量低減技術の開発
公開日2012/7/11
報告書年度2011 - 2011
委託先名学校法人立命館 株式会社アドマテックス 九重電気株式会社 株式会社クリスタル光学
プロジェクト番号P08023
部署名電子・材料・ナノテクノロジー部
和文要約和文要約等以下本編抜粋:
1. 研究開発の内容及び成果等
本研究開発の目的は,ガラスの鏡面研磨材として使用される酸化セリウムの使用量を30%以上削減することである.そこで,3つの戦略でこれを実現することにした.一つは酸化セリウムの成分割合を削減した複合砥粒の開発である.二つ目は,通常研磨に比較して40%以上の高加工能率と同等の仕上げ面粗さを持つ加工技術の開発であり,最後は同等の加工特性を持った酸化セリウム砥粒を全く使用しない加工技術の開発である.通常の遊離砥粒研磨は,工作物,砥粒,工具の3つの要素からなる3BODY 研磨技術で,研磨能率と仕上げ面粗さを同時に高めることは難しい.これに対してプロジェクトリーダが開発した4BODY 研磨においては,このトレードオフの関係が打ち破られ,仕上げ面粗さを維持しながら研磨能率を向上することが可能であること.この4BODY 研磨法の概念から,本研究開発では砥粒,メディア粒子,研磨パッド(工具),プロセス技術の4つの観点に注目し,それぞれの因子に関して2つの研究項目を選定し,すなわち合計8つの研究項目において研究開発を実施した.その具体的内容は以下の通りである.
英文要約Title : Rare Metal Substitute Materials Development Project. Development of reduction technology of the use of cerium for glass polishing and its substitute materials. Development of reduction technology of ceria usage applying 4-body finishing method (FY2009-FY2012) FY2011 Annual Report
The purpose of this research project is to reduce more than 30% of cerium oxide usage as mirror-polishing agent for glass material. Then three research strategies were established to realize the purpose. First is to develop abrasive-free processing which has same machining performance with conventional polishing. Second is to develop composite abrasives to decrease concentration of cerium oxide which have the same finishing performance and third is to develop process technologies which have more than 40% higher removal rate and same surface finish in comparison with conventional polishing. In this year, we conducted following research. First, to increase polishing performance of classified composite abrasives, we tried to improve the stagnation of composite abrasives. It is considered that the high specific gravity particles added to slurry inhibit the mobility of composite abrasives, which can increase the stagnation of abrasives. The several additive particles including WO3, W, CuO increased the removal rate of classified composite abrasives. Furthermore, the core-shell particles in which a polymer particle forms a core and inorganic layer covers the polymer particle, were employed as additive particles. Consequently, the usage of cerium oxide abrasives was decreased by 90 %, and the removal rate was increased by 25 % compared with conventional polishing using CeO2 abrasives. Next, plate-like aluminum oxide (Al2O3) particles were employed as the inorganic media particles. The plate-like Al2O3 particles can improve the stagnation of abrasives, which enhances the polishing performance. By applying plate-like Al2O3 particles, the removal rate of glass was increased by 40 %compared with conventional polishing without deteriorating the roughness of finished glass surface. Furthermore, we have developed a novel urethane-containing epoxy resin pad to increase the flexibility of the epoxy resin pad. The fabricated urethane-epoxy resin had a higher flexibility and showed a smaller cutting resistance during the slicing process than the epoxy resin. Although the removal rate of glass using the urethane-epoxy pads decreased by approximately 10% compared with that using epoxy pads, it was still 60% higher than that using a conventional polyurethane pad. The urethane-epoxy pad produced a glass surface with a lower surface roughness than the conventional urethane and epoxy pads. Finally, we investigated the effect of polishing tools on the performance of chemically assisted polishing. It is found that the slurry supply between work piece and tool was important to obtain smooth glass surfaces. For the chemically assisted polishing, an artificial lawn pad was found to be more effective than the conventional porous urethane polishing pad.
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