成果報告書詳細
管理番号20120000000836
タイトル*平成23年度中間年報 次世代大型有機ELディスプレイ基盤技術の開発(グリーンITプロジェクト)
公開日2012/7/12
報告書年度2011 - 2011
委託先名長州産業株式会社 株式会社島津製作所 JSR株式会社 大日本スクリーン製造株式会社 日立造船株式会社 ソニー株式会社 株式会社東芝 シャープ株式会社 住友化学株式会社 出光興産株式会社 独立行政法人産業技術総合研究所
プロジェクト番号P08011
部署名電子・材料・ナノテクノロジー部
和文要約和文要約等以下本編抜粋:
1. 研究開発の内容及び成果等
(1)研究開発項目1「低損傷大面積電極形成技術の開発」(執筆担当:長州産業)
・ 今年度は、有機ELディスプレイ用電極の低損傷大面積製造プロセスの確立に向け、トップエミッション構造の発光素子を用いた低損傷電極作製技術の評価を行った。また電極作製技術の生産性の検証も合せて行った。
英文要約Title: Development of Basic Technology for Next-generation Large-screen Organic Light-emitting Diode Displays (Green IT Project) (FY2008-FY2012) FY2011 Annual Report
 The development project named " Development of Basic Technology for Next-generation Large-screen Organic Light-emitting Diode Displays (Green IT Project) " started in fiscal year 2008. Main theme of this project are as follows. 1) Development of less damage electrode deposition technology. 2) Development of transparent sealing technology. 3) Development of thin organic layer fabrication technology. 4) Simulation of productivity for large-size display manufacturing.
1) Regarding low damage, electrodes on reference organic cells were prepared by “Mirrortron Sputtering”. The increase by several percentages of threshold voltage and changes in electrode performance were observed by comparing the initial properties of the cells. It was demonstrated that the half-life of the prepared cells with the electrodes transitioned almost equally with the one of the reference cells. Therefore, it is estimated that electrode preparation by “Mirrortron Sputtering” causes some changes in electrode performance but the damages in organic cells are extremely small. The half-life measurement is continuously conducted to accumulate data. Three possible reasons are identified for the changes in the initial properties, and scheduled to be examined in the next year. Regarding productivity, the productivity of electrode structure that realizes the ultimate target value for the electrode performance was examined. 2) Transparent desiccant material and passivation film deposition techniques were investigated as the sealing technology for a large size panel.  It was obtained that the encapsulation structure with 1-μm-thick-SiN passivation film followed by the modified desiccant material showed high reliability result, i.e., the organic LED device with the encapsulation structure was found almost no deterioration after more than 1000 hours under 60°C, 90% RH atmosphere.
3) Both printing and evaporation techniques for thin organic LED layer deposition were investigated for large size panel preparation. By investigating varied process margins and simulating the precision of equipment in large size at the same time, it was confirmed that the influence of precision decline in large size could be well within the margin. Less than 3% of thickness distribution was obtained in substrate with the size of 20 cm x 20 cm. Cell - type manufacturing system with Planar Source evaporation using organic LED material was investigated for large size panel. Down deposition type planar source for G6 substrate was constructed to confirm over 60% of material yield and within 3% of film thickness uniformity.
4) A fundamental evaluation device structure was determined for the internal OLED test sample to achieve the ultimate goal of low-power consumption and to accomplish a productive panel manufacturing scheme for large-screen “top-emission” OLED displays. In addition, less-damaged formation of ultra-thin interlayers was investigated for Mirrortron sputtering technique to complement the fabrication process of the transparent cathode with efficient electron injection. The basic experimental data was collected from research subject 1)~3) to improve the reliability of the simulation technology aiming at virtual large-screen display manufacturing with substrates in G6 or larger.
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