成果報告書詳細
管理番号20120000000555
タイトル*平成23年度中間年報 太陽エネルギー技術研究開発 太陽光発電システム次世代高性能技術の開発 極限シリコン結晶太陽電池の研究開発 (銅ペーストの研究開発)
公開日2012/11/28
報告書年度2011 - 2011
委託先名独立行政法人 産業技術総合研究所
プロジェクト番号P07015
部署名新エネルギー部
和文要約和文要約等以下本編抜粋:
[事業内容]
本提案の目標低コスト化を実現するためには、結晶Si太陽電池における電極構成部材に対しても、現行の銀から低価格の銅への代替を実現することが求められている。しかし、銅は酸化されやすく容易に電極形成させることができない。本提案では、銅と他の各種金属を混ぜて、偏析しない均一組成のナノコンポジット粒子を採用することで次の事項を実現する。
英文要約Title: High Performance PV Generation System for the Future. R and D on Ultimate Wafer-based Si Solar Cells. (Glass-fritless Cu Alloy Pastes for Low Temperature Sintering) (FY2010-FY2012)FY2011 Annual Report
We propose Cu paste with low melting point (LMP) material as a binder to replace Ag paste. Ag paste is often used as a conductive paste for solar cell electrode because of its intrinsic high conductivity, even if Ag itself is a precious metal. Since Ag prices are recently skyrocketing, naturally, Cu that is much cheaper than Ag and has a relatively high conductivity is collecting a lot of attention as one of the promising alternatives for the Ag. However, there are some issues to be solved for the replacement. For example, Cu is easily oxidized in the air compared to Ag, which makes it difficult to decrease the resistance and requires elaborate, reductive atmosphere (typically, 3%H2 + N2). On top of that, Cu is known to easily migrate into semiconductor materials such as silicon. Low temperature sintering pastes have attracted much attention because they can minimize the damage for p-n junction of solar cell. The mechanism of the thermal induced conductivity can be considered as follows. Heating causes curing and shrinking of a thermosetting polymer, which get the conductive particles so close as to establish the conductivity by mechanical contact with each other. The electrical conductivity could be limited since it relies on the partial physical contacts. This report describes our progress of a novel Cu paste for low temperature sintering (<200℃). Our developed Cu alloy pastes feature addition of a LMP alloy. After melted, LMP alloy can diffuse into the inside of Cu particles as well as the spaces between Cu particles so that it may cover the whole Cu surfaces with formation of a metal bonding with Cu. It can be expected not only to enhance the conductivity, but also to prevent oxidation of Cu and migration into substrates.
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