成果報告書詳細
管理番号20130000000825
タイトル*平成24年度中間年報 ナノテク・先端部材実用化研究開発 ナノ粒子と極低酸素技術による超微細銅配線樹脂基板のインクジェット形成技術の研究
公開日2013/10/18
報告書年度2012 - 2012
委託先名株式会社イオックス 株式会社SIJテクノロジ 日本特殊陶業株式会社 地方独立行政法人大阪市立工業研究所
プロジェクト番号P05023
部署名電子・材料・ナノテクノロジー部
和文要約
英文要約Title: Research and development of inkjet micro wiring process on resin substrate by using nano- copper ink and the extremely-low oxygen partial pressure technology. (FY2010-FY2012)FY2012 Annual Report.

1 “Development of Super Inkjet equipment and its process for ultrafine copper pattern”
Screening evaluation has performed using 65 kinds of copper inks from different points of view, such as, pot life, patterning stability, drying speed, wetting ability, jetting ability, etc  As the result, we could find some nice ink and using it, a Line/Space = 5μm/5μm pattern has been performed on a resin substrate We also developed a repellent ink for cupper patterning. 2.1μm thickness copper wiring was achieved with combination of the repellent ink and copper ink. Further improvements for the materials and process to achieve the target values on interconnection resistance, adhesion strength, L&S, thickness is now ongoing.
2 “Research and development of the synthetic process of Cu nano-particles and the application to ink material”
In this part, we have studied about the copper nanoparticle inks optimized to the ultra-fine line formation by ink-jet printing with low resistivity and high adhesion strength to the substrates. The size control of the copper nanoparticles was investigated to improve the printing resolution and the dispersibility to the solvent. By sophisticated synthetic process of copper nanoparticles, the particle size could be controlled in the range of 20 - 200 nm, and by evaluated the dispersibility of the nanoparticles in various solvents, we have found that terpineol is a good solvent for the copper nanoparticle inks. By using the copper nanoparticle inks and super inkjet technology, the copper fine-lines with the minimum width as L/S = 5/5μm can be formed. Furthermore, the terpineol derivatives and acrylic resins were added to copper nanopaticle inks to improve the initial adhesion and to suppress the cracks in the copper file-line. As a result, the resistivity of copper fine-line was 8.1 μΩ-cm.
3 “Development of extremely-low oxygen partial pressure technology”
A relationship between the resistivity of the sample and the SEM cross sectional image was revealed. The process time for low-oxygen sintering was shortened to about 1/20. This was made possible through the optimization of the oxygen partial pressure (p(O2)) in each step of the new two-step process. Plasma processes were introduced. Microwave plasma in a low pressure environment gave 7.6 microhm cm with a two-minute exposure, showing promise for short-time processes. Atmospheric pressure plasma of the low p(O2) gas, when tried in air, did not have a reducing power due to large air inclusion. The process was redesigned to be performed in a sealed box, which is almost completed.
4 “Evaluation of Ink-jet Process Technology for Ultra-fine patterning substrate”
We have investigated adhesion strength between copper ink and insulator. The anchor effect should be effective for higher adhesion strength but it needs rough surface. On the other hand, roughing process will cause negative effect for ink printability. In order to satisfy both of low profile surface and higher adhesion strength, we applied new insulator material which was treated by special process. As a result, we could see significant improvement in peel strength on smooth surface(Ra=28nm) compared with standard process material and the strength is more than 0.3kgf/cm. We will conduct further assessment for productivity and production cost as next step.
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