成果報告書詳細
管理番号20140000000704
タイトル*平成25年度中間年報 新エネルギー技術研究開発 太陽エネルギー技術研究開発 太陽光発電システム次世代高性能技術の開発 銅ペースト量産化技術と試験・評価方法に関する研究開発
公開日2015/1/31
報告書年度2013 - 2013
委託先名ナミックス株式会社
プロジェクト番号P07015
部署名新エネルギー部
和文要約
英文要約Title: Research and Development of Mass Production Technology for Cupper Paste and Evaluation method. (FY 2012-2014) FY 2013 Annual Report

(1) Development of Firing Type Cu Paste. In the case of firing type Cu paste, specific resistivity must be low after firing in N2 condition. Six test paste were formulated for confirm the combination. The test 5 shows best combination of Cu powder, binder. This was caused by binder burn out effect. Unfortunately, however, even in this combination, the problem of Cu diffusion was not solved. So for firing type Cu paste requires some “barrier layer” for solve this problem. (2) Development of Curing Type Cu Paste.The prototype cell was fabricated by using previously developed Cu paste to prove our concept. First, firing type Ag paste was printed on wafer surface and fired at same protocol of normal production process. After that, developed curing type Cu paste was printed as bus-bar. Cu paste printed cell was putted in N2 condition furnace and Cu bas-bar was cured. The IV result of this cell showed the same as fully Ag electrode printed cell. However, the rheology of this prototype Cu paste was not sufficient for screen printing. To modifying this, we had to change the paste composition. The five Cu powder was tested for control rheology (powder A to E). In this case, all sample paste were used the same resin composition. Powder B and C showed the lowest specific resistivity. These two powders made by same protocol and the others were not. According to this result, we found that powder production method is quite effective to control the specific resistivity. To further control of rheology, resin composition was modified using powder B. We found the only resin B shoed strong effect for specific resistivity. We made cells using this developed Cu paste and confirmed the curing temperature effect. According to this result, the low curing temperature showed lower cell efficiency. We think this was caused by to high specific resistivity of bus-bar (cured Cu electrode). High specific resistivity might lead high contact resistnace between bus and finger, and as a consequence, the efficiency became low. Also for reliability, we think lower curing temperature is much suitable (i. e. around 200 °C). For further development, the targets are lower curing temperature (about 200 °C) and low specific resistivity (10-6 Ω cm order).
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