成果報告書詳細
管理番号20140000000670
タイトル*平成24年度中間年報 太陽エネルギー技術研究開発 太陽光発電システム次世代高性能技術の開発 極限シリコン結晶太陽電池の研究開発(太陽電池向け100μmウェーハの効率的加工技術の構築)
公開日2015/2/19
報告書年度2012 - 2012
委託先名コマツNTC株式会社
プロジェクト番号P07015
部署名新エネルギー部
和文要約
英文要約Title: Construction of efficient processing technology of 100μm wafer for Photovoltaic (FY2010-FY2014) FY2012 Annual Report

The purpose of our research and development is slice technology establishment of the amount of the material use of 40% that can be reduced. (Compared with 2010) Concretely, it is an end goal to establish processing conditions that become possible for 100μm wafer to process the slice with 100μm karfloss. We carried it out with the cut of the 120μm wafer in this year. As a result, the yield was good and demonstrated that I could process it. We carried it out with the cut of the 100μm wafer in this year. As a result, the yield was not good (Around 80%). We extracted a problem when we processed a thin wafer with a thin wire. We carried out an examination mainly on the processing using the wire of calf loss 100μm (core line 80μm). As a result, We were able to achieve the processing at 95% or more of yield, and to be able to reduce karfloss.
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