成果報告書詳細
管理番号20140000000683
タイトル*平成24年度中間年報 太陽エネルギー技術研究開発 太陽光発電システム次世代高性能技術の開発 銅ペースト量産化技術と試験・評価方法に関する研究開発(1)
公開日2015/2/19
報告書年度2012 - 2012
委託先名ナミックス株式会社
プロジェクト番号P07015
部署名新エネルギー部
和文要約
英文要約Title: Research and Development of Mass Production Technology for Cupper Paste and Evaluation method. (FY 2012-2013) FY 2012 Annual Report

(1) Curing type Cu paste
 At the first, the effect of Cu powder was investigated. Four type Cu powder were used for test (other compositions and Cu powder content were the same). The test pastes were printed on c-Si wafer (which had SiNx:H layer), and specific resistance was evaluated. The maximum curing temperature was 200 °C, and total process time was 60 min. According to the result, specific resistance is strongly dependent on the Cu powder (one of them showed infinite resistance, others showed few m- order). The curing temperature also improved specific resistance. The sample which was cured at 250 °C showed much lower specific resistance (about 20 mW cm). This is expected that the neck formation between Cu powders was enhanced by temperature and organic/Cu interaction. To research this interaction, specific resistance of curing type Cu paste might be able to be improved. (2) Firing type Cu paste. Test Cu pastes were formulated using binders which applicable to base metal powder. Two test pastes were formulated. The same binder, solvent, and Cu powders were used for these pastes, but they contain different inorganic additives. This paste was printed on c-Si wafer (15 × 15 mm) which has anti reflection coating (ARC, SiNx:H). Printed samples were fired using N2 gas flow belt furnace at different maximum temperatures (630, 730 and 780 °C). The total firing time was 8 min. The conventional silver paste was also used for reference. The I-V property was measured by solar simulator under AM1.5, 1 sun condition. The Cu01 sample showed temperature dependence of fill factor same as silver paste sample. However, the value of FF did not accomplish final goal. In the case of Cu02 sample, the value of FF was not improved by firing temperature. According to this result, inorganic additives (including glass frit) are the key point for firing type Cu paste. Cu01 sample showed lower Voc deterioration than silver reference sample. However, Cu diffusion must be prevented for long-term reliability of the cell. For this reason, some barrier layer should be inserted underneath Cu electrode. The series resistance of Cu sample showed quite high value. This is expected by poor densification of Cu powder at N2 atmosphere. Even in this point, the inorganic additives (including glass frit) should be developed for Cu paste.
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