成果報告書詳細
管理番号20150000000411
タイトル*平成26年度中間年報 SIP(戦略的イノベーション創造プログラム) 革新的設計生産技術 分子接合技術による革新的ものづくり製造技術の研究開発
公開日2015/7/18
報告書年度2014 - 2014
委託先名国立大学法人岩手大学
プロジェクト番号P14030
部署名ロボット・機械システム部
和文要約
英文要約Title: Research and development of innovative manufacture using molecular adhesion technology (FY2014-FY2015) FY2014 Annual Report
(1)Development of innovative surface and interface control and adhesion technology by innovative molecular adhesion agent
From the QCM and XPS results, it was confirmed that triazine-based silane coupling agent (TES) can adsorbed to metal surface and adsorption amount is most at buffer solution (pH 3).
(2)Development of innovative compounding technology and metallizing technology for micro powder
Carbon nanospheres (CNS) were synthesized by hydrothermal treatment of D-glucose. TES was used to improve the wettability of CNS. After TES treatment dispersibility and electrically conductive of the CNS were improved.
(3)Development of innovative molecular bonding agent and analyzing characteristics technology
Design the R-triazine-based silane coupling agent through the design the reaction and functional groups.
(4)Research of special resin and the development of excellent processability technology
A new synthetic method of halogen-free and high-purity PPS was designed and established, which have the advantages of low cost, mild polymerization conditions, easily removal method of by-products, and environmentally friendly.
(5)Innovative thermal measurement technology, development of electric technology, construction of surface and interface model
The compounds with high thermal conductive were designed. Surface treatments and particle size selection of the thermally conductive fillers were investigated.
(6)Development of innovative product through surface modification and the technology of property evaluations
Reactivity between various metal surfaces and TES were investigated by XPS and FTIR. The results showed that the functional groups of thiol, alkoxy, amino groups in TES react to metal especially to the surfaces after plasma treatment. Primary adhesion process between metal, ceramics, resin and rubber were introduced.
(7) Research of fluid and non-fluid adhesion technology and the applications
To improve the contact resistance flexibility has become essential in many applications. Contact resistance below 0.1℃/W, voltage resistance over 10kV/mm, hardness below 85 as target values, flexible compounds with thermal conductivity were designed.
(8)Application research of next generation microprocessor unit (MPU) for socket
The number of terminals becomes a problem with the microprocessor unit process speed increasing. The housing combining resin parts with metallic board for the crosstalk avoidance between terminals was designed. Detmold and partial plating were studied.
(9)Practices and confirmations of innovation style
For the introduction of technology and recruiting companies, the exhibitions of Yokohama 2015 technical show and other two exhibitions were participated in. To be well-known by the consortium, various sponsored conferences and information exchange meeting were performed.
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