成果報告書詳細
管理番号20150000000621
タイトル*平成26年度中間年報 超低消費電力型光エレクトロニクス実装システム技術開発
公開日2015/8/4
報告書年度2014 - 2014
委託先名技術研究組合光電子融合基盤技術研究所
プロジェクト番号P13004
部署名電子・材料・ナノテクノロジー部
和文要約
英文要約Title: Integrated Photonics-Electronics Convergence System Technology (FY2013-FY2017) FY2014 Annual Report
Key technologies of Photonics Electronics Convergence Device
a) Photonics and Electronics Integration Technologies: A trial of Si-photonics-based optical I/O cores with 5 mW/Gbps was completed. Optical coupling pins were applied to 12-channel optical I/Os. A 25 Gbps/ch error-free transmission over 300 m MMF was accomplished. A 25 Gbps transmission using polymer wave guide was demonstrated.
b) Photonics and Electronics Integrated Device Technologies:
A novel structure for cancelling a phase-offset was demonstrated. A novel micro-ring assisted delay-line based WDM filter achieved both flat and box-like response. A bidirectional WDM device with wide temperature tolerance conforms to the GE-PON standard. III-V devices were integrated with waveguides on bulk-silicon.
c) Photonics and Electronics Interface Technologies:
Prototyping of DSP-LSI for 100Gbps DP-QPSK modulation was accomplished. A drastic improvement was achieved 1/3 reduction in both size and power. Miniaturized optical components reduced their volume less than 1/2.
d) Photonics and Electronics Circuit Design Technologies:
Integrated design environment from device to substrate for the photonics-electronics converged packaging was strongly developed. A new design tool, which bridges the device simulator and the electromagnetic field simulator through FDTD method, was developed.
e) Innovative Device Technologies:
Quantum-dot lasers coupled with a silicon waveguide by wafer bonding has been achieved. Ge photodetectors with suppressed dark current on Si were demonstrated. An error-free operation up to 25 G of photonic crystal modulators and photon transfer between two distant nano-cavities were demonstrated. Other researches on photonic wiring in nanoscale, hybrid photonic devices and optical switches were successfully achieved.
Application Technologies of Integrated Photonics-Electronics Convergence System
a) Optical interconnect technologies between CPUs and Memories:
A 25 Gbps/ch error-free transmission using optical I/O core with FPGA was demonstrated. Operations of 25 Gbps silicon-photonics optical I/O, embedded in CPU package, were demonstrated. A data transfer operation of a hybrid optical I/O SSD was demonstrated.
b) Active Optical Cables, connecting between CPU boards, racks:
A QSFP based Active Optical Cable, applying optical I/O core engine, was demonstrated.
c) Digital coherent transceiver for networks between data centers:
A CFP pluggable 100 G digital coherent transceiver was developed and confirmed they can be applied to data center optical interface from 80 km to 600 km.
d) Si photonics transceiver chips for passive optical network applications:
A prototype integrated chip set was developed and corresponding bidirectional optical transceiver was experimentally evaluated.
e) International standardization:
Taking part in OIF and IEEE802.3 was continued to build up the human network.
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