成果報告書詳細
管理番号20150000000373
タイトル*平成25年度中間年報 次世代スマートデバイス開発プロジェクト 車載用障害物センシングデバイスの開発
公開日2015/9/12
報告書年度2013 - 2013
委託先名株式会社デンソー ラピスセミコンダクタ株式会社 独立行政法人産業技術総合研究所
プロジェクト番号P13005
部署名電子・材料・ナノテクノロジー部
和文要約
英文要約The aim of this project
The aim of this project is to develop ranging sensor devices which can detect pedestrians and vehicles night and day. To accomplish this, photo detectors installed in an array and signal-processing circuits are implemented in three dimensions. This improves the effective area of the photo detectors and reduces the electrical wiring length, which improves the sensitivity and wide range accuracy. This year’s achievements are shown below.
1. Ranging sensor and the circuit
A target specification for the ranging sensor was defined. Specifications include everything from the size of photo detectors to the ranging circuit architecture. These items were set as parameters and the performance of the sensor has been verified by the simulation. Specifications for the architecture of the digital signal-processing circuit were also defined. The contents include: a control method for obstacle detection with the input from the sensor and an implementation of the circuit and memories. The performance and circuit size has been estimated by simulation.
2. Integrated design environment
An investigation of three-dimensional (3D) IC design was carried out and used to create a development item list. Additionally, TSV were arranged assuming an actual sensor chip, automatic layout was performed, and a TSV-capable IC design flow was proposed.
3-1. Development of the printing TSV technology
A prototype machine for TSV metal filling was built and tested with encouraging results. An experimental tool for TSV insulator filling was installed to accelerate its test and development.
3-2. Development of the printing bump and wafer warpage reduction technology
An initial investigation into micro-bumps formed by printing technology resulted in the selection of different materials for front and back-side bumps.
3-3. Development of the TSV process integration technology
Technical issues related to the TSV structure were clarified and a TEG was used to verify the process. An investigation of annular trenches of various pitches/sizes as well vias created using various methods yielded encouraging results.
3-4. Development of the low stress chip stack and connection technology
Benchmarking of various stacking technologies including C2C, C2W, W2W was done. Then the specifications of the equipment to be development were determined. A technical issue related to the stacking process was clarified.
4-1. Development of the three dimensional packaging inspection technology
We examined the specifications of the probe pin for micro-bump probing, performed a feasibility study on non-destructive analysis of TSVs and clarified technological issues in detecting failure modes in flip-chip joints.
4-2. Development of the three dimensional packaging evaluation technology
The specifications for the in-vehicle sensing device by the assumed 3D packaging technology were extracted and work on an integrated analytical evaluation system was begun.
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