成果報告書詳細
管理番号20150000000622
タイトル*平成26年度中間年報 次世代半導体微細加工・評価基盤技術の開発 EUVマスク検査装置・レジト材料基盤技術開発
公開日2015/10/24
報告書年度2014 - 2014
委託先名株式会社EUVL基盤開発センター
プロジェクト番号P10025
部署名電子・材料・ナノテクノロジー部
和文要約
英文要約Title:EUV mask inspection tool and resist material fundamental research (FY2014-FY2015) FY2014Annual Report

EUV resist material research
1. Simulation investigations (with Osaka University) on resist reaction mechanisms were carried out to clarify resist material guidelines for higher sensitivities at patterning for and beyond hp 11nm. As a result, it was understood that to achieve the line edge roughness (LER) target of <0.9nm for these pattern sizes, a photo-acid generator concentration of at least 30% with careful consideration of the generated acid’s quantum efficiency will be necessary.
2. On the research and development of acid amplifier materials for higher EUV sensitivity (with Tokyo University of Science), the design and synthesis of a new polymer-bound acid amplifier resin was demonstrated resulting in a 10% sensitivity improvement.
3. Meanwhile, investigations on high EUV sensitivity material platforms at EIDEC have resulted in the development of a new non-chemical amplification metallic resist (EIDEC standard metallic resist or ESMR). Using the ESMR; 17nm lines were fabricated using electron beam exposure at an ultra-high sensitivity of 1.5mJ/cm2 (equivalent dose at EUV). These preliminary results prove the high sensitivity / resolution potential of these metallic resist platforms.
4. The disassembly and reassembly of the HSFET tool body in preparation for the high-NA upgrade were successfully completed. In advance of optics installation, it was confirmed that the tool’s mechanical performance met the HSFET requirements. Then, the illumination optics (SG and IFR module) was successfully installed into the HSFET main body. The alignment accuracy between SG and IFR modules was better than the specification. Next, the EUV source was optically aligned to the illumination optics. After that, 500 Hz operation had been successfully confirmed. Finally, PO heat shield and mount ring were installed in the main body.
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