成果報告書詳細
管理番号20150000000706
タイトル*平成26年度中間年報 国際エネルギー消費効率化等技術・システム実証事業 (実証要件適合性等調査) 超低コスト太陽電池量産技術実証に関する調査
公開日2016/3/1
報告書年度2014 - 2014
委託先名株式会社マテリアル・コンセプト
プロジェクト番号P93050
部署名イノベーション推進部
和文要約
英文要約International Demonstration Project for Mass-production Technology of Low-cost Solar Cells(FY2014-FY2015)FY2014 Annual Report

(1) Firing furnace makers for copper paste are investigated. Among various candidates for firing furnace makers, we selected two domestic and two oversea makers to collect detailed information. Domestic company A makes a conventional fire-through furnace for silver paste. With this furnace, however, paste baking would be performed in a batch process. In addition, heating and cooling time are too long, and gas switching also requires long time. Domestic company B is known to make a good effort to meet customer needs with flexibility in a wide range of applications. However, they limit their activity inside Japan. Therefore, they do not fit to provide a furnace for the implementation project. In the US, Company C has a demonstration furnace that may satisfy our specification. We are in continuous contact with Company C. Company D is a leading company in the field of solar cell furnace and has a good R&D capability. We tried to contact but have had no response. We will seek other opportunity to make direct contact at exhibitions and conferences.
(2) Current technology status, price, and R&D trend of paste makers are investigated. Ag-paste finger lines in advanced cells have a width of 50 to 60 um and a height of approx. 15 um. The available methods of screen printing include a conventional single printing method, a double printing method, and dual printing method. All methods are aimed at increasing light receiving area and at reducing line resistivity. Active effort to reduce Ag consumption has led to the use of Ag paste from 140 mg to 100 mg per cell. The line resistivity and contact resistivity of the finger lines are 5μΩcm and 1 to 5 mΩcm2. The adhesion strength of TAB lines is 2 to 4 N. We consider
that the year 2017 is expected to be a good timing for mass production of Cu paste.
(3) Solar cell market and R&D trend are investigated. R&D effort has been focused on efficiency improvement, and mass production of PERC and PERT cells are within our reach. Some cell makers have already shipped out PERC cells. Meanwhile, emitter formation for PERT cells is done either by thermal diffusion or by ion implantation followed by activation anneal. The ion implantation method requires additional cost for the introduction and running of the implantation machine. However, Applied Material says no problem with the total cost. With regard to Cu cells, there is nothing new. Electroplated Cu does not show much progress and has not been implemented for mass production. So far, we do not find any news of competing technology.
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