成果報告書詳細
管理番号20160000000136
タイトル*平成27年度中間年報 エネルギー・環境新技術先導プログラム ナノソルダー技術とサステナブル社会実装応用に関する研究開発
公開日2016/4/15
報告書年度2015 - 2015
委託先名国立大学法人東北大学 パナソニック株式会社 住友金属鉱山株式会社 国立大学法人群馬大学 国立大学法人大阪教育大学
プロジェクト番号P14004
部署名イノベーション推進部
和文要約
英文要約Nanosolder fabrication process was developed and improved in 42Sn58Bi for application of high temperature solder. Experimental conditions were investigated about low material concentration, quantity of solvent and ultrasonic condition, etc.. We achieved high yield (94.7%, 37.88g/day) and highly-concentrated composition (94.7g/L) by the optimization of reaction in 42Sn58Bi nanosolder. Nanosolder was dispersed in solution without dispersant, and it was considered that nanosolder formed secondary particle and dispersed about 100nm and 500nm. In electron microscopy observation, spherical atomized solder powder as nanosolder starting powder were changed formless fine nanoparticle agglomerate in all ultrasonic irradiated conditions. These formless agglomerate were constructed amorphous Sn-Bi alloy and crystalized Bi nanoparticle (< 2nm). Sn part in formless agglomerate were detected O by STEM-EDX. The quantity of oxygen detection tended to increase so that particle size was small. These highly-concentrated nanosolders were sent to each organization for microstructure and property characterization, pasting. Nanosolder pasting process was devided in three steps (dispersion of nanosolder, condensation of nanosolder solution, mixture of flux) for high efficiency experimental. Dispersion agent investigated for dispersion of nanosolder in this term selectively. Agglomeration behavior at evaporation of the solvent in nanosolder solution was also observed for pasting. It was observed that agglomeration and grain growth of nanosolder in evaporation process. In case of flux addition, it was observed that molten behavior of nanosolder. However nanosolder could not melt by using flux as oxidation of surface in nanosolder. We also examined methodology of the thermodynamic analysis for screening of the nanosolder alloy composition, characteristic evaluation by the thermal analysis and analysis of the joining mechanism. We calculated metal thermodynamics properties and the particle size dependence of the melting point by HGM (homogeneous melting and growth model). We investigated documents level of the parameter necessary for calculations such as the surface free energy and built an original database in pure metal. After calculating the particle size dependence of the metal melting point as element of lead free solder (Sn, In, etc.), We agreed with a reported value on some documents well. By thermodynamic analysis, we were able to predict driving force of the sintering as well as the melting point descent of metal nanoparticles. It is hoped that useful information was given us in analyzing the experimental data.
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