成果報告書詳細
管理番号20160000000146
タイトル*平成27年度中間年報 エネルギー・環境新技術先導プログラム 特長ある機能性液体材料の実用化に向けた研究  
公開日2016/4/19
報告書年度2015 - 2015
委託先名国立大学法人北陸先端科学技術大学院大学
プロジェクト番号P14004
部署名イノベーション推進部
和文要約
英文要約Title: Research for putting characteristic functional liquid materials into practical use (FY2015-FY2016) FY2015 Annual Report

Item A Development of oxide materials
A1. Low temperature processing of thin film transistors (TFTs)
A1-1. Component layers
(1) Insulator film for a gate layer
As organic ligands for hybrid clusters, propionic acid (PrA), acetylaceronate (acac) and nitric acid (NO3) were investigated. The cluster gel using the acac ligand showed the broadest absorption property. The cluster gels constructed both by PrA and acac ligands were more promptly solidified than the gel composed by the nitric acid ligand by the UV irradiation at 200 degree C.
(2) Semiconductor film for a channel layer
A InZnO semiconductor material was investigated for a channel layer. Ligand substances for hybrid clusters were also investigated. The nitric acid ligand showed the better result than organic ligands. High field effect was confirmed in the stacked structure of IZO/SiO2/Si.

A1-2. Fabrication of TFT
TFTs were fabricated at 200 degree C using the UV irradiation technique. The TFT using the PrA ligands did not operate, while the TFT using the acac ligands successfully operated with the mobility of 0.47cm2V-1s-1.

A2. Low temperature formation of oxide barrier films
AlO material was chosen for a barrier film. Selection of ligands and the condition of solution preparation were carried out. The film formed by UV irradiation at 200 degree C solidified as a level of the solidification at higher temperature.

Item B. Fine metal line
B-1. Basic technologies
The process, which aims to fabricate copper metal lines and metal mesh devices having the line width of 8um, have been carried out. First, a glass substrate was coated by a polymer which played an adhesive layer between the substrate and metal lines. Subsequently PPC resin was coated on the adhesive layer and imprinted. Sharp imprinted patterns were confirmed. Then the substrate was dipped into the diluted silver ink. The ink was spontaneously patterned base on the hydrophobic-hydrophilic nature of the substrate. As a result, narrow silver lines remained after the removal of PPC resin. During the process the patterned lines were heated to be solidified at 150 degree C. As a final process, copper was deposited on the silver lines by using an electro-less plating method. The copper lines, of which line width and height were 7.1um and 886nm respectively, were successfully formed without any removal.

B-2. Transparent electrodes
Using the result of B-1, the metal mesh device in which the metal lines having the width of 8um and the pitch of 200um was developed. Its transparency was confirmed.
B-3. Flexible print circuits
The fundamental experiment has just started.
B-4. Display applications
No action.

Item C (Activity). Exploratory Committee
C-1. For the flexible electric paper
Two companies will be participated to a committee.
C-2. For the metal line technology
Four companies will be participated to a committee.  
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