成果報告書詳細
管理番号20160000000483
タイトル*平成27年度中間年報 インフラ維持管理・更新等の社会課題対応システム開発プロジェクト インフラ状態モニタリング用センサシステム開発 道路インフラ状態モニタリング用センサシステムの研究開発
公開日2016/7/22
報告書年度2015 - 2015
委託先名技術研究組合NMEMS技術研究機構
プロジェクト番号P14011
部署名ロボット・AI部
和文要約
英文要約Title: Research and Development of Sensing System for Road Infrastructure Monitoring System (FY2014-FY2016) FY2015 Annual Report

The results of research and development of sensing system for road infrastructure for FY2015 are summarized as follows:
(1-1-1) Development of bridge sensing system utilizing super acoustic sensor
 The basic structure of MEMS super acoustic sensor was decided and a prototype sensor was fabricated. Power consumption was confirmed to be approximately 1.1W. The 3D AE tomography method that could detect a position of the invisible internal damage precisely was established.
(1-1-2) Development of bridge sensing system utilizing flexible 2D-strain-pattern sensor sheet
 The process to manufacture an ultrathin silicon strain sensor was established and a prototype of the flexible 2D-strain-pattern sensor sheet with arrayed 25 ultrathin strain sensors was fabricated. Sensitivity of 1x10-6 was verified. A weatherproof protection film was fabricated.
(1-2) Development of inclination sensing system of road ancillary structure
 The sensor output stability of 0.69[gal] was confirmed. A wireless module was produced and it was confirmed that wireless communication distance was more than 30m. The circuitry of the inclination multi-sensor terminal was completed and achieved power consumption of 2.9mW (average).
(1-3) Development of the slope displacement sensing system
 The implementation of the optimal method about a wireless mesh network was competed and its operation was confirmed. The detailed design in consideration of decrement due to the vegetation was completed. It was confirmed that displacement more than 4mm an hour can be detected.
(2-1) Development of common platform for the wireless communication network
 Indoor connection test between a concentrator and the sensor of each sensing system was completed. The change of the receiver module by the remote management was confirmed. A mesh network function was implemented and the 3 hop communication was achieved.
(2-2) Development of the high durable packaging technology
 The board design for built-in omnidirectional antenna of 920MHz of LTCC board was developed. Low temperature (approximately 40 ℃) bonding technology between LTCC and transparency ceramics by laser local site heating, a noncorrosive sheet film laminating process, and the adhesive sheet for concrete and steel were developed. Durable acceleration tests were also conducted.
(3) Verification and evaluation study on sensing system for road infrastructure monitoring
Pilot RIMS with the functions of cooperation with the RIMS sensors and expressway company database was developed. 1 or 2 candidate places suitable for each sensing system test were selected.
(4) Research and development of chip scale atomic clock for sensor terminal
A protocol to predict the variation in reference frequency was proposed. The utility of the protocol was confirmed. The target performance of time synchronization is expected to be achieved with Cs/Rb dual gas cell as well as the proposed protocol. Design plan to reduce the power consumption less than 10mW was obtained.
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