成果報告書詳細
管理番号20160000000552
タイトル*平成27年度中間年報 次世代ロボット中核技術開発 (革新的ロボット要素技術分野)ブレイン・マシン・インターフェース 超低侵襲,超低負担な神経電極デバイス技術のBMI応用
公開日2016/7/22
報告書年度2015 - 2015
委託先名国立大学法人豊橋技術科学大学
プロジェクト番号P15009
部署名ロボット・AI部
和文要約
英文要約Title: Strategic Advancement of Multi-Purpose Ultra-Human Robot and Artificial Intelligence Technologies (Next-generation AI technology) brain-machine interface / Low invasive needle- and ECoG-electrode devices for brain-machine interface technology (FY2015-FY2016) FY2015 Annual Report

The goal of this research project is to develop technologies for low-invasive neuronal recording devices, realizing a new class of brain-machine interface (BMI) technology based on these electrodes. Although conventional electrodes have made contributions in neuroscience and BMI technology, invasiveness of these devices still has room for improvement. In addition, it is necessary to improve signal quality (e.g., spatiotemporal resolution and signal to noise ratio) in the neuronal recording, in order to enhance the performance of BMI technology. As an approach to low invasive needle-electrode technology, we have proposed ~5-μm-diameter needle-electrode devices by silicon growth technology. To quantitatively measure needle penetrationーinduced physical stress of brain tissue, here we propose a quantitative analysis by monitoring brain tissue deformation. The surface of a brain is marked with color dots and monitored with a CCD camera during electrode penetrations. Results show that it is possible to measure the surface deformation of the brain. The proposed methodology would be a way to display the advantages of our low invasive microneedle-electrode device. We also performed batch fabrication technique of the needle-electrode device. The proposed process achieved batch fabrication of ~ 600 devices per wafer through single process steps. Furthermore, the estimated costs (e.g., material costs and labor costs) per device is expected to be lower than that of conventional Utah Array (Blackrock, ~ 400,000 JPY) and Michigan Probe (~ 100,000 JPY), enabling mass production of our device as a new tool in neuroscience and medical applications. In this project, we have also proposed a 5-μm-thick filmーbased ECoG electrode array device. To connect the device to signal recording amplifier systems, the device needs to be packaged with either flexible printed circuit (FPC) or printed circuit board (PCB). The ECoG electrode device can be manually connected to FPC/PCB with conductive epoxy. However, this leads to low device yield in electrode connections. We have overcome this issue by simply sandwiching an anisotropic conductive sheet (Shinetsu polymer inc.).
ダウンロード成果報告書データベース(ユーザ登録必須)から、ダウンロードしてください。

▲トップに戻る