成果報告書詳細
管理番号20160000000583
タイトル*平成27年度中間年報 次世代ロボット中核技術開発 革新的ロボット要素技術分野 次世代ロボットのためのマルチセンサ実装プラットフォーム
公開日2016/7/22
報告書年度2015 - 2015
委託先名国立大学法人東北大学
プロジェクト番号P15009
部署名ロボット・AI部
和文要約
英文要約Title:Strategic Advancement of Multi-Purpose Ultra-Human Robot and Artificial Intelligence Technologies/Future robot technology/Multisensor Installation Platform for Next Generation Robots (FY2015-FY2015) FY2015 Annual Report

1. Summary of research and development in FY2015
We have 2 research themes before the stage gate as follows:
1.Proof-of-concept of bus type network platform for multi-type sensor implementation
2.Development of an active sensing method combining a heater and a temperature sensor
In FY2015, we obtained the following results beyond the initial plan:
1-1.Different configurations of sensing enabled by our prototyped interface LSI
Different configurations (e.g. scale factor) of sensing was demonstrated for a capacitive sensor with the interface LSI. An LSI-integrated temperature sensor and resistive type sensors also worked with the interface LSI.
1-2.Real time operation of different types of sensors on the same shared bus
Two LSIs with multiple sensors worked on a shared bus; one connected with 2 capacitive type force sensors and the other connected with 7 resistive type force sensors.It was demonstrated that all data from the two LSI could be acquired at every 100ms.
1-3.Implementation of a number of sensors on a shared bus, and analysis of network behavior (FY2016 theme)
This theme is for FY2016, but partially conducted in advance. 15 LSIs were connected with a shared bus, and worked successfully. Many tests were performed and it was eventually found that parameters for the internal setting of the LSI must be properly set according to practical situations. Currently, the number of sensors was increased up to several tens or more to achieve the goal in FY2016.
1-4.Development of integrated MEMS-LSI sensors
The integration of a MEMS sensor and a CMOS LSI is done by our developed Au-Au wafer bonding technology. The Au-Au bonding is a key for the integration process, and the bonding strength and yield were improved by optimizing process parameters.
1-5.Active sensing (- FY2016 Q1)
A temperature sensor embedded in the interface LSI was tested. To improve the resolution of temperature, an FPGA-based host controller was developed with new software programs. 3.3k samples per second in temperature sensing was achieved.
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