成果報告書詳細
管理番号20160000000729
タイトル*平成27年度中間年報 低炭素社会を実現する次世代パワーエレクトロニクスプロジェクト 窒化ガリウムパワーデバイスの実用化促進等に関する先導研究 窒化ガリウム基板の高平坦・無潜傷・超高速研磨プロセスの研究
公開日2016/8/23
報告書年度2015 - 2015
委託先名株式会社岡本工作機械製作所
プロジェクト番号P10022
部署名IoT推進部
和文要約
英文要約Expertise and knowledge is essential in development of the gallium nitride substrate in order to realize its high-performance potential prior to building of the epitaxial structure. Current technology for development of the gallium nitride substrate is accomplished over a few days where high-flatness and non-latent scratches are unavoidably produced. Although gallium nitride is chemically very stable, the current chemical mechanical polishing (CMP) techniques take a few days of processing time; therefore, the current development cost to for the substrate is very expensive. Current study has found that using ultraviolet light and a strong alkaline functional water polishing agent with a polishing rate of 0.5μm / min, a surface roughness below Ra 0.1nm can be achieved with no measureable subsurface damage, and a significantly shorter CMP time. An extraordinary chemical reaction is achieved by selecting the ultraviolet wave length band; where in this process, the use of ultraviolet light and the strong functional water abrasive achieve outstanding flatness and no measureable subsurface damage. Reduction for development costs can be realized with utilization of this innovative process to attain the high-efficiency and high-performance of the gallium nitride substrate. Thus far, as an accelerator, the most effective wavelength for gallium nitride has been in the ultraviolet band. Furthermore, the properly selected polish pad can further optimize the ultraviolet light transmission. It has been confirmed that reactivity with most gallium nitride and ultraviolet light to be under the wavelength of 365 nm. It also possible to find a polishing pad that can transmit light under the same wavelength of 365nm. Objective for the gallium nitride polish testing was to optimize and achieve a high-speed polishing rate with excellent surface roughness and no measureable subsurface damage.
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