成果報告書詳細
管理番号20160000000730
タイトル*平成27年度中間年報 低炭素社会を実現する次世代パワーエレクトロニクスプロジェクト 次世代パワーエレクトロニクス応用システム開発の先導研究 SiCモジュール特性を前提とした新車両主回路システムの基礎研究
公開日2016/8/5
報告書年度2015 - 2015
委託先名公益財団法人鉄道総合技術研究所
プロジェクト番号P10022
部署名IoT推進部
和文要約
英文要約Title: Next Generation Power Electronics Project for a Low Carbon Emission Society/Feasibility Study of Improved Systems for Next Generation Power Electronics/New Traction Circuit Systems using Property of SiC Modules for Trains (FY2015-FY2016) FY2015 Annual Report

 In order to reduce the size and weight of railway vehicles, we are executing the research of the new transformer-less traction circuits which apply the SiC modules properties and also the research of developing high reliability SiC modules.

1. The basic study on the new vehicle circuit systems [Railway Technical Research Institute]
We proposed new traction circuits which use the SiC modules instead of the main transformers’ insulation, manufactured on an experimental basis their circuit models, and executed the verification experiments. The proposed circuits which ensure insulation transmit power with the flying capacitor method. According to the results of verification tests of bidirectional operation, we could demonstrate that power transmitted up to the input voltage-200 V and the switching frequency-20 kHz run, while ensuring the insulation and also without the simultaneous occurrence of charging current and the discharging current.

2. The study of constitution materials of SiC module [Railway Technical Research Institute]
 The constitution materials of SiC module are required to have high heat conduction, low thermal expansion and proper insulation characteristics for ensuring high reliability of module. We studied the characteristic improvement of the constitution materials such as a board, a sealing, and a package, by the application of the composite material which uses reinforcement fiber of an organic super fabric of high heat conduction, low thermal expansion, and proper insulation characteristics. We have fabricated constitution materials of SiC module by combining this fiber cloth and heat-resistant, high thermal conductivity epoxy resin. We have tested heat characteristics of these fabricated materials. As a result, we have verified that the thermal conductivity in the plane direction of these materials was larger than that of the conventional materials using a glass fiber cloth, the glassy-transition temperature was more than 200 degrees in case of the heat-resistant type epoxy resin.

3. The study on the high reliability 1200 V/300A SiC modules [National Institute Advanced Industrial Science and Technology]
 The development of 1200V/300A power modules for the train main circuit using SiC-MOSFETs and SiC-SBDs and a gate driver was performed. After several times of trial, the board with resistances and capacitances that connect gates of SiC-MOSFETs was developed for the suppression of the oscillation in the operation. This board is arranged on the substrate which SiC-MOSFETs and SiC-SBDs are mounted. The measurement value of current capacity and the blocking voltage of this power module are >300A, and >1200V, respectively. This switching test of ID=300A at VDD=600V was performed. The thermal cycle test (-40℃-125℃) of the power module is also carried out to confirm if it has high reliability. The electrical characteristics of the power module are stable up to at least 700 cycles.
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