成果報告書詳細
管理番号20160000000759
タイトル*平成27年度中間年報 クリーンデバイス社会実装推進事業 次世代半導体を用いた超小型電力変換モジュールの多用途社会実装
公開日2016/9/7
報告書年度2015 - 2015
委託先名ニチコン株式会社 国立大学法人大阪大学
プロジェクト番号P14016
部署名IoT推進部
和文要約
英文要約Title:Clean Device Promotion Project,"Promotion of SiC power modules through both field test for identified use cases and standardization of reliability", (FY2015-FY2016), FY2015 Annual Report


This project is intended to break though the ground of SiC power modules, by executing not only field tests for the identified use-cases but also reliability and safety tests for global standardization. Final deliverable is as follows. 1)Field test results; Particle accelerator for medical use, Vehicle to home and power-generating station 2)Report on function and safety of SiC power module 3)Reliability test guideline 4)Draft version of standardization
Nichicon has successively designed and proposed two prototypes of SiC power modules considering the functional demands for three use-cases: 1200V, 80A and 1200V, 40A, respectively. Drive circuit and power circuit are built in the module so as to minimize parasitic inductance and noise. The static, dynamic and thermal characteristics are recognized as designed. These design processes are expected to lead to a common design rule.Three major field tests are under plan: advanced medical system, stand-alone power generator and vehicle to home system utilizing them.
  Osaka University has identified thermal resistance test and transient heat conduction test as a first step of the target standardization, taking the importance of high temperature operation of SiC devices and modules that is required in the process of downsizing and improved fast-response.As the first step of standardization process,the high temperature resistance benchmarking test has been started, which consists of high temperature storage test (250 °C - 1000 h), heat cycle test (-50 ~ 250 °C - 500 cycles) and power cycle test. The initial run was finished and the analysis is underway. In parallel with these activities, the framework, which promote domestic and global standardization, has been built. The collaboration with JPCA is aimed for the thermal characteristic test standardization and that with JEITA is for the power cycles, which are the two of the key features of wide band gap(WBG) devices. Osaka University also organized the symposium on “WBG interconnection symposium on Power Electronics” in December to open the gate of cooperation between Japan and EU with JEUPISTE.
JEUPISTE: Japan-EU Partnership in Innovation, Science and Technology
ダウンロード成果報告書データベース(ユーザ登録必須)から、ダウンロードしてください。

▲トップに戻る