成果報告書詳細
管理番号20160000000179
タイトル*平成27年度中間年報「高性能・高信頼性太陽光発電の発電コスト低減技術開発/革新的新構造太陽電池の研究開発/超高効率・低コストIIIーV化合物太陽電池モジュールの研究開発(プラスチックレンズ一体型セル・モジュール)」
公開日2016/12/14
報告書年度2015 - 2015
委託先名パナソニック株式会社
プロジェクト番号P15003
部署名新エネルギー部
和文要約
英文要約Title: Development of high performance and reliable PV modules to reduce levelized cost of energy, Research and Development of innovative new structure solar cells, Research and Development of ultra-high efficiency and low-cost III-V compound semiconductor solar cell modules (Plastic lens integrated III-V compound semiconductor cell module) (FY2015-FY2017) FY2015 Annual Report

The target of our project in this year is to design a fundamental module structure of PIC (Plastic lens integrated III-V compound semiconductor cell), and to develop the fundamental fabrication process of the module. We designed PIC module structure and the main parts of the module, including an optical system for concentrating sunlight on a solar cell, an electronic circuit board, and a dispersion mechanism of the heat in a solar-cell. A glass plate was used for the circuit board instead of plastic material. We developed the fabrication method of the parts and the assembling method of the module from the parts, where the focal axis of primary and secondary lenses are aligned by mechanical fixing. Two types of modules, a module for testing the structure (2×2 square cm area) , a module for testing fabrication method (12×12 square cm area), were fabricated using our developed method. The energy conversion efficiencies of both modules were over 30 percent, which is the efficiency of our target in 2017 fiscal year. The detailed analysis of the photovoltaic properties of the modules indicates that the main factors degrading their efficiencies are optical loss of lenses and the Joule heat loss in the solar cell. The optical loss and the Joule heat loss are estimated to be 22 percent and 10 percent, respectively. We proposed the methods to suppress these losses, and plan to achieve the efficiency of 38 percent of our target in 2019 fiscal year using the methods. These results demonstrate that our proposed module structure and the fabrication method can be applicable to the module which satisfies the properties of our final target, a cost, efficiency, and durability. In the next year, we develop PIC module which uses a circuit on plastic material. In this year, we aimed to decide the material which can be printed to be a circuit on plastic material. Many sorts of material were tested from a viewpoint of process temperature, applicability to printing method, and cost. We selected a Ag-epoxy resin-mixture paste from these materials, and improved the paste to decrease the process temperature. Finally we succeeded in making the circuit with a resistivity 50 micro ohm cm of our target on a poly-methylmethacrylate plate. In the next fiscal year, we solve the challenges in this year and decide the structure and fabrication process of PIC module.
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