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成果報告書詳細
管理番号20170000000219
タイトル*平成28年度中間年報 次世代スマートデバイス開発プロジェクト 車載用障害物センシングデバイスの開発
公開日2017/5/9
報告書年度2016 - 2016
委託先名株式会社デンソー ラピスセミコンダクタ株式会社 国立研究開発法人産業技術総合研究所
プロジェクト番号P13005
部署名IoT推進部
和文要約
英文要約Title: R&D Project for the Next Generation Smart Device / Development of an Obstacle Sensing Device Available for Vehicles

The aim of this project is to develop ranging sensor devices which can detect pedestrians and vehicles night and day. To realize this, photo detectors installed in an array and signal-processing circuits are implemented in three dimensions. By doing so, the effective area of the photo detectors is enlarged and electrical wiring length shortened, which improves the sensitivity and wide range accuracy. This year's achievements are given below.

(1)-1. Ranging Sensor Device and Circuit Development
We designed a large-scale array of light-receiving devices. The evaluation by simulation and a trial fabrication was performed.

(1)-2. 3D Integrated Design Environment
We have expanded on our prototype tools from FY2015 to release the 2nd version of the integrated design tools. We evaluated the influence of the post-process on the device characteristics. The evaluation results were fed back for 3D integration process development.

(1)-3-1. TSV Process Integration
Based on the guidelines to meet the reliability needs of vehicular applications planned in FY2015, the TSV process was improved. According to the result of the thermal cycling test and the electromigration test, we confirmed that the improved process meets the needs of vehicular applications.

(1)-3-2. Printed TSV Development
The voidless printing was achieved by improving the supply method and cooling method of molten metal, and the coating method and baking method of insulator material. We have continued to design a metal printing equipment for voidless printing and material consumption reduction.

(1)-3-3. Printed Bump Development and Wafer Warpage Reduction
The solder material was selected as its mutual diffusion is less than the conventional material. The TEG fabrication and the reliability test was performed. The Kirkendall voids and the growth of the alloy layer at the joint were suppressed. The reliability of the combined printed TSVs and micro-bump structure for the vehicular applications was confirmed.

(1)-3-4. Low-Stress Chip Stack and Connection Development
For the combined structure of the TSV and bump proposed in FY2015, we confirmed that the solder TSV and the bumps can be bonded without leakage by the thermo-compression bonding process with a solid phase diffusion bonding method. The resistance of a daisy chain TEG can be steadily reduced to less than 1 ohm.

(1)-4-1. 3D System Inspection
Not performed in this fiscal year

(1)-4-2. 3D System Evaluation
We have continued to develop analysis and evaluation methods that take into account the various electrical, thermal and mechanical needs of the system and used these methods to design, test and evaluate a device for the vehicular 3D integrations system and provide the guideline of the fabrication process for low-cost and high reliability device. We worked with JEITA-3D and SEMI to create draft proposals for international standards.
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