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成果報告書詳細
管理番号20170000000232
タイトル*平成28年度中間年報 次世代プリンテッドエレクトロニクス材料・プロセス基盤技術開発
公開日2017/5/11
報告書年度2016 - 2016
委託先名次世代プリンテッドエレクトロニクス技術研究組合
プロジェクト番号P10026
部署名IoT推進部
和文要約
英文要約Development of Basic Technology for Next-generation Printed Electronics Materials and Process Technology project.
(FY2016-FY2018) FY2016 Annual Report

5: Development of customized process basic technology
(1) We have studied about soluble fluorine compounds and uneven structure of PDMS for customized mask. The etching method for soluble fluorine compound, the etching selectivity between PDMS and soluble fluorine compounds, adhesion properties between the fluorine compounds and photoresist film, and inking technology on soluble fluorine compounds are investigated. In these investigations, we have determined the mask structure and the material for inking mask.
(2) This year’ goal is to confirm the fixed precision of mechanical specification within ±50μm for free sheet transport. We confirmed the fixed precision of our machine within ±22.1μm. We have also investigated the substrate shrinkage by the 30s/sheet process (1 pass process). These results will be reflected on the design of next printing machine.

6: Development of flexible composite function device technology
(1) We have investigated the gate insulation film with relative permittivity 1.5 times higher than the conventional organic insulator for lower driving voltage of the TFT. We can operate TFTs with a driving voltage of 20 V while maintaining leakage current. We have analyzed the charge transport mechanism of the JAPERA device with Tokyo Institute of Technology (Prof. Yutaka Mashima) to clarify factors contributing to reliability by displacement current measurement.
(2) We have compared with the ACF connection method and the bump connection method proposed by JAPERA. The connection temperature can be lowered to below 100 ° C compared with ACF of 145 ° C. and the peel strength is expected to be doubled. In the bending test, it was found that the resistance value change is smaller than that of the ACF connection method.
(3) We have fabricated a seat type multi-point detection sensor assuming target devices A and B. And we have demonstrated that the area distribution of pressure and temperature can be detected, and completed the circuit and software design to operate them. To form the pressure and the temperature sensitive layers, we have investigated the characteristics of the ink materials and the design of TFT structure. Based on these conditions, a prototype of the sheet device was performed.

5&6: Development of process / device demonstration / platform technology
(1) We exhibited the seat type multi-point detection sensor at Nano-tech 2017 (Feb. 2017) and CeBIT (Mar. 2017) and investigated the demand from the market. We also have prepared for patenting in new applications with Tokyo University (Prof. Takeshi Naemura).
(2) We have summarized the requirements of the market for highly compatible target devices by printed electronics through feedback of the result of use case fitting by field test (exhibition at exhibition and demonstration by individual company visit) and proceeding with correspondence.
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