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成果報告書詳細
管理番号20170000000651
タイトル*平成28年度中間年報 次世代人工知能・ロボット中核技術開発 革新的ロボット要素技術分野 次世代ロボットのためのマルチセンサ実装プラットフォーム
公開日2017/8/30
報告書年度2016 - 2016
委託先名国立大学法人東北大学
プロジェクト番号P15009
部署名ロボット・AI部
和文要約
英文要約1. Summary of research and development in FY2016

We have 2 research themes before the stage gate as follows:
1. Proof-of-concept of bus type network platform for multi-type sensor implementation
2. Development of an active sensing method combining a heater and a temperature sensor
In FY2016, we obtained the following results listed in Fig. 1. For the above theme 1, we divided the theme into the following 4 small research concepts: “multi-type sensor”, “multiple sensors”, “event-driven response”, and “active sensing”. For proving these 4 topics, we planned the following 4 research topics:

(i-1) Different configurations of sensing enabled by our prototyped interface LSI
After fabricating the integrated tactile sensor, we confirmed the sensitivity change by changing the configurations of the interface LSI (Fig. 1(i-1)).

(i-2) Real time operation of different types of sensors on the same shared bus line
We connected 2 interface LSIs on a shared bus line (Fig. 1(i-2)). An LSI was connected to 2 capacitive type sensors and 1 temperature sensor. Another one was connected to 7 resistive type sensors. For real time sensing, we programmed the system includes the relay node and the host for high-speed processing and transmission. As a result, we can acquire 3-axis sensing data at 3,300 samples per sec.

(i-3) Multiple senor implementations
For a multiple sensor implementation with a number of interface LSIs on a shared bus line, we simulated impedance and load changes with an electromagnetic simulator. Based on the simulation and the equivalent circuit models, we can find the optimal transmission line structures. This method estimates more than 100 interface LSIs can be mounted on a shared bus line (Fig. 1(i-3)). We fabricated a board system, and proved 48 interface LSIs could operate simultaneously. Also, we proved the event-driven response with 16 interface LSIs

2. Firstly, we fabricated an integrated fingertip sensor, which has a 3-axis force sensor and a temperature sensor and multi functions in the interface LSI (Fig. 1(ii)). With applying a constant force to an object, this fingertip sensor can sense temperature information in real time. After touching the heated up fingertip sensor to the object, through the device we can monitor temperature change depending on the target thermal conductance, thermal capacity and contact resistance. We proved by using this system that we could distinguish the materials, which is the active sensing.

For finding wide and promising application targets, we did market search. Fig. 2 shows an overview of the target applications which potentially can be realized by our proposed platform. In addition to this NEDO project, we will go forward related projects for practical use.
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