Self-Healing Phenomenon of Bonding Materials for Use with SiC Power Semiconductors Discovered
－Promoting Applications in the Automotive Sector through Improvements to Long-Term Reliability Improvements－
March 28, 2016
New Energy and Industrial Technology Development Organization (NEDO)
As part of a NEDO project, Osaka University and DENSO Corporation discovered a self-healing phenomenon of bonding materials that can be used to improve the long-term reliability of SiC (silicon carbide) power semiconductors.
Researchers discovered that cracks on bonding materials were self-repaired in equipment operating in high-temperature environments. As a result of this discovery, the applicability of SiC power semiconductors in the automotive sector and similar industries has been greatly enhanced.
(left: before repair, right: after repair)
For more information, please contact:
NEDO Electronics, Materials Technology and Nanotechnology Department
Contact Persons: Mase, Sugiyama