成果報告書詳細
管理番号20100000001162
タイトル*平成21年度中間年報 次世代大型有機ELディスプレイ基盤技術の開発(グリーンITプロジェクト)
公開日2010/11/10
報告書年度2009 - 2009
委託先名長州産業株式会社 株式会社島津製作所 JSR株式会社 大日本スクリーン製造株式会社 日立造船株式会社 ソニー株式会社 東芝モバイルディスプレイ株式会社 シャープ株式会社 住友化学株式会社 出光興産株式会社 独立行政法人産業技術総合研究所
プロジェクト番号P08011
部署名電子・情報技術開発部
和文要約和文要約等以下本編抜粋:1. 研究開発の内容及び成果等(1)研究開発項目(1)「低損傷大面積電極形成技術の開発」 ・ 有機ELディスプレイ用電極の低損傷大面積製造技術に関して、ミラートロンスパッタ方式を検討した。今年度はより低抵抗の電極を得るための手法の検討および成膜実験を行い低抵抗化の可能性を示した。また、電極の抵抗率と可視光損失率とが電力消費に与える影響を定量化し、個別の性能よりも損失電力を最小化する総合的な性能が重要であることを明らかにした。また、成膜時の有機層への損傷の程度を評価する手法の基礎検討を行い、光学的手法および電気的手法の開発に目処を立てた。低抵抗化が必要な通常の透明電極膜の成膜では加温が必要であるが、有機薄膜上に透明電極を成膜するトップエミッション構造では、損傷を伴う加温は行えない。そこで、常温で透明電極膜の成膜にミラートロンスパッタ法を用いることにより可視光損失率10%以下でも、通常のインジウム錫酸化物を加温下で成膜した場合の透明電極膜の抵抗の1.3倍以内に抑えられることを明らかにした。
英文要約Title: Development of Basic Technology for Next-generation Large-screen Organic Light-emitting Diode Displays (Green IT Project) (FY2008-FY2012) FY2009 Annual Report
 The development project named " Development of Basic Technology for Next-generation Large-screen Organic Light-emitting Diode Displays (Green IT Project) " started in fiscal year 2008. Main theme of this project are as follows. 1) Development of less damage electrode deposition technology. 2) Development of transparent sealing technology. 3) Development of thin organic layer fabrication technology. 4) Simulation of productivity for large-size display manufacturing.
1) The “Mirrortron Sputtering” was investigated to deposit electrode material with less damage on organic EL layer under room temperature condition. It was revealed that the electrical resistivity of the Indium Tin Oxide electrode prepared by this method at room temperature could be controlled to become less than 1.3 times of that with conventional sputtering in high temperature condition. The damage level of the EL device during the electrode deposition was evaluated by the newly developed optical and electrical measurement techniques. Furthermore, the consumption efficiency of the target materials of this sputtering technique was improved to become more than 2.4 times of the conventional method.
2) Transparent desiccant material and passivation film deposition techniques were investigated as the sealing technology for a large size panel. It was obtained that modified desiccant material showed more than 99% transmittance and longtime stability in the air exposure without any color change. Surface Wave Plasma (SWP)-CVD technology was proved to keep temperature low during the inorganic passivation layer deposition compared with other CVD technologies. It was revealed that highly transparent passivation film could be obtained by deposition of Si3N5 film by this technique.
3) Both printing and evaporation techniques for thin organic EL layer deposition were investigated for large size panel preparation. Optimization of printing conditions such as ink formulation and equipment processing parameters were studied to obtain a highly uniform organic EL layer with high EL efficiency by single fast deposition. Cell - type manufacturing system with planer source evaporation using organic EL material was investigated for large size panel. High film thickness uniformity within 3% could be obtained for deposited film on a 600 X 700 substrate.
4) Factors for reduction of the power consumption and processability of a large size organic EL panel were investigated. The simulation technique for evaluation of the power consumption of large size panel was developed. Investigation of major factors which are responsible for the scalability of the organic EL panel preparation was started for each fabrication process.
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