成果報告書詳細
管理番号20100000002204
タイトル*平成21年度中間年報 省エネルギー革新技術開発事業/先導研究/セルロースエアロゲル材料を利用した透明超断熱ガラスの研究開発
公開日2010/11/10
報告書年度2009 - 2009
委託先名日本板硝子株式会社
プロジェクト番号P09015
部署名省エネルギー技術開発部
和文要約和文要約等以下本編抜粋:1. 研究開発の内容及び成果等
1.1. エアロゲルの断熱性評価
小面積の試料で熱伝導率を測定し、そのデータとシミュレーションによる比較を行い、熱伝導率に影響する材料およびプロセス因子を解析し、様々な条件で調整したエアロゲルの断熱性を評価する。平成21年度は温度計測による定常熱流測定にもとづいた評価を行った。
1.1.1. 熱伝導率測定
(1) 熱伝導率の測定原理
熱流センサーと温度センサーが埋め込まれた、高低温プレート間に試料をセットし、温度を一定に保つ。熱伝導率は式(1.1)で求めることができる。
熱伝導率 λ = (Qh+Qc/2)・(L/ΔT) … (1.1)
Qh :高温側熱流量 QL :低温側熱流量 L :試料の厚さ
ΔT:高温側サンプル表面温度(Th)と低温側サンプル表面温度(Tc)との差
英文要約Title: Development of Transparent Ultra-High Thermal-Insulating Glazing Using Cellulose Aerogels (FY2009-FY2010) FY2009 Annual Report
1: Evaluation of thermal-insulating properties of cellulose aerogels 1.1: Thermal conductivity measurements of aerogels We measured thermal conductivity of small aerogel samples. The measuring part of the system consists of “cold” and “hot” plates holding the sample. Considering the thermal flux from the hot side to the cold side by using the temperature difference between the two sides, thermal conductivity is evaluated. Several measurements yielded values from 0.002 to 0.006 W/mk. 1.2: Simulation Two types of software were selected to investigate thermal conduction of aerogels. One is a program to analyze thermal conduction including radiation effects and the other can deal with thermal conduction by air convection. We carried out benchmark tests to verify the accuracy of the two programs by modeling thermal measurement with in-house equipment. The tests yielded thermal conductivity values similar to the data obtained by experiments. 2: Fabrication and evaluation of vacuum glazing having aerogel gap-pillars 2.1: Low-temperature sealing Low-temperature hermetic sealing is required for the vacuum glazing having aerogel gap-pillars because aerogels cannot withstand temperatures above 200 deg C, which is estimated from the components of the material. One group of promising candidates is low melting-temperature solders. For example, typical Sn-Zn solders melt at around 200 deg C. In-Sn solders allow sealing at around 100 deg C. However, these solders and glass do not readily join and require some activation to form bonding interfaces. It means that sealing proceeds by applying solder part by part, not by firing the entire glazing. 2.2: Investigation of degas from aerogels under atmospheric pressure An experimental set up was considered and prepared for analysis of degassing from aerogels. The system is a combination of a furnace for heating the aerogel sample and gas-chromatography, which allows quantitative analysis of gas components. We carefully selected an electric furnace that meets our specifications, especially thermal uniformity of the heating zone in the furnace to ensure temperature accuracy of the sample. 2.3: Measures to suppress degassing from aerogels A research plan was formulated to investigate measures to suppress degassing from aerogels. We estimated that the following two groups of substances are probably released as gas from aerogels: a) Residual substances including water and solvents used in the gelation process. b) Decomposed substances generated by irradiation of light and/or thermal degrading. For suppressing a), we will look into adsorption and desorption behaviors of water at the surface or in the bulk of aerogel by thermal analysis, which also reveals thermal behaviors of the material. To decease b), surface modification of aerogel will be effective.
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