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成果報告書詳細
管理番号20180000000169
タイトル*平成29年度中間年報 IoT推進のための横断技術開発プロジェクト トリリオンノード・エンジンの研究開発4(ディー・クルー・テクノロジーズ株式会社)
公開日2018/6/2
報告書年度2017 - 2017
委託先名ディー・クルー・テクノロジーズ株式会社
プロジェクト番号P16007
部署名IoT推進部
和文要約
英文要約Title:Project to develop cross-sectoral technologies for IoT promotion / Trillion node engine platform (FY2016-FY2019) FY2017 Annual Report.

It is anticipated that 50-billion IoT nodes will be in use in 2020 and 1 trillion in the 2030s. In order to make this to be fully realized, the Trillion-Node Engine Project aims at stablishing a platform for IoT nodes including hardware and software, featuring (1) the power consumption of 1/10, (2) the volume of 1/100, and (3) the time to market of 1/10 of the conventional approaches, while realizing capability of building and modifying an IoT node on site outside the factories even without soldering.

As a microcircuit for trillion node engine, we are conducting research on development of connection chips. With the miniaturization of the leaf board, it is necessary to reduce the number of signals between the leaf boards. For that purpose, it is necessary to multiplex the signals in the leaf board and connect the boards. We confirmed the operation of this specification with the prototype using FPGA.

On the basic model leaf board, connection chips became unnecessary, so we did not manufacture the LSI. We examined specification of LSI for leaf board of the premium model.

In order to develop and disseminate the trillion node engine as open source hardware, We created several leaf boards in addition. (1) ARM Cortex-M0 leaf (High-performance microcomputer:48MHz/Flash 256kB/SRAM 32kB) . (2) LoRa leaf (LPWA:Low Power Wide Area). (3) 6-AXIS leaf (6-axis acceleration sensor). (4) BLE leaf (Bluetooth Low Energy).

Research and development items
1. Technology for leaf interconnect
2. Open environment for collaboration
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