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Technology Development Project to Strengthen the Semiconductor Manufacturing Base of Energy-Saving Electronics

Project overview

Project period: FY2021 to FY2025, budget: 2.65 billion yen (FY2023)

In recent years, as the IoT and electrification of industries have progressed, the importance of semiconductor-related technologies has increased, and there is a greater need for energy saving in such industrial equipment. The key to this is "energy-saving electronics technology." This technology is represented by "power semiconductors," which are mounted in electronic devices to control electric power, and semiconductor manufacturing equipment, which is indispensable in the production of all types of semiconductors. Although Japan has conventionally been strong in this field, there have been intensified efforts in recent years in countries around the world.
This project strengthens the semiconductor manufacturing of energy-saving electronics products by working on "1. development of new generation power semiconductors" and "2. development for sophistication of semiconductor manufacturing equipment" toward the realization of a decarbonized society. It also contributes to the reduction of CO2 emissions by reducing power conversion losses through the application of sophisticated power semiconductors and semiconductor manufacturing equipment to key industrial sectors and semiconductor plants.

Research and Development

(1)-1 Development of Gallium Oxide Power Semiconductors

This initiative establishes necessary basic technologies, develops new-generation power semiconductors for specific applications, and conducts prototyping and evaluation of modules, thereby demonstrating that the new-generation power semiconductors are at a feasible level for practical use.

(1)-2 Development of Large-diameter Intelligent Silicon Power Semiconductors

This initiative develops power semiconductors (intelligent silicon power semiconductors) with extremely sophisticated self-control functions, such as automatic optimization and fault prediction, by adding AI and other functions to large-diameter silicon power semiconductors.

(2) Technological Development for Sophistication of Semiconductor Manufacturing Equipment

This initiative develops innovative technologies for semiconductor manufacturing equipment that is necessary to improve the performance and productivity of dry etch systems, exposure systems, and deposition systems (CVD systems, etc.), which have particularly large shares in the semiconductor manufacturing equipment market and are significant for maintaining and strengthening the competitiveness of Japanese corporations. It also develops innovative technologies such as three-dimensional lamination-related equipment, including lamination technology at the semiconductor back-end process, as next-generation manufacturing equipment required in the post-Moore era.

  • Explanatory image of new generation power semiconductors

    New Generation Power Semiconductors
  •  Explanatory image of sophistication of semiconductor manufacturing equipment

    Sophistication of Semiconductor Manufacturing Equipment

Project Leader

KAKUSHIMA Kuniyuki (Associate Professor, School of Engineering, Tokyo Institute of Technology)

Basic information

Technical field Networks and computing
Project code P21009
Department in charge Internet of Things Promotion Department (TEL: +81-44-520-5211)

Last Updated : December 25, 2023