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Elephantech Inc.
Mass Production Demonstration of Equipment and Materials for Multilayer Printed Circuit Boards (PCBs) Using Nano Copper Inkjet Printing

As of July, 2025

City Year of Establishment Founder
Chuo-ku, Tokyo 2014 Shinya Shimizu, Masaaki Sugimoto
Partner VC Latest round of Fundraising Valuation
- Series E Non-Disclosure

Program name

Deep-Tech Startups Support Program in the Green Transformation field

Research theme

Mass Production Demonstration of Equipment and Materials for Multilayer Printed Circuit Boards (PCBs) Using Nano Copper Inkjet Printing

Business Plan

Elephantech develops and provides SustainaCircuits®, a PCB manufacturing technology based on an additive method that replaces conventional subtractive counterparts. It leverages our proprietary copper nano-ink materials and high-precision industrial inkjet printing technology.

This initiative focuses on commercializing SustainaCircuits® for multilayer PCB mass production, with the goal of advancing a sustainable manufacturing ecosystem by offering a practical and easily adoptable solution for PCB manufacturers.

Research Outline

Our objective is to drive the adoption of SustainaCircuits-powered additive multilayer PCB manufacturing through the following four R&D tracks:

  1. Development of mass-production-ready inkjet printing equipment for seed layer formation in multilayer PCB manufacturing
  2. Development of proprietary materials for SustainaCircuits solution at mass production level
  3. Development of multilayer PCB manufacturing process utilizing our inkjet equipment and materials
  4. On-site mass production validation at PCB manufacturing facilities
Phase Business Area/Field Research Period Research Grant Amount
DMP Materials 2025-2027 FY JPY 2,291 million

Last Updated : November 14, 2025