Holoway Inc.
Development of Semiconductor Advanced Packaging Inspection Equipment
As of December, 2025
| City | Year of Establishment | Founder |
|---|---|---|
| Kobe | 2023 | Kunihiro Sato |
| Partner VC | Latest round of Fundraising | Valuation |
|---|---|---|
| Globis Capital Partners | Series A | JPY 2,635 million |
- Contact Information: Non-Disclosure
- Website: Holoway Inc.
Program name
Deep-Tech Startups Support Program
Research theme
Development of Semiconductor Advanced Packaging Inspection Equipment
Business Plan
Leveraging proprietary digital holography technology, we are developing measurement and inspection solutions required for semiconductor advanced packaging—a field with high expectations for societal implementation in AI, autonomous driving, and the metaverse.
Research Outline
This research and development project aims to elevate our proprietary digital holography technology into a semiconductor measurement and inspection solution. By achieving high precision and high throughput, we seek to solve challenges in advanced semiconductor processes where further innovation and QCD improvement are required.
| Phase | Business Area/Field | Research Period | Research Grant Amount |
|---|---|---|---|
| STS | Information & Communication | 2025-2027FY | JPY 292 million |
International collaborative technology demonstration
| Countries/Regions | Collaborative activity outline |
|---|---|
| Asia, United States, Europe etc. | — |
Last Updated : April 21, 2026